TE Connectivity

Why TE Connectivity? It's simple; in the data communications space, we are experts. Our innovative portfolio of enterprise data center and hyperscale applications anticipate today's needs – and account for tomorrow's standards. We offer a complete portfolio of solutions for high performance computing (HPC) applications:

Backplane & board-to-board Input/output Power Copper cable assemblies Sockets

TE Connectivity (TE) is a valued development partner for a wide variety of cable assembly, socket and board-to-board connector solutions, TE's variety of server solutions for Intel® Omni-Path Architecture is extensive.

ChipConnect Internal Faceplate-to-Processor Cable Assemblies
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Looking for high speed? ChipConnect cable assemblies may be what you need. Used in Intel® Xeon Phi™ processor 7200F series, these cable assemblies directly transmit signal from the processor to the faceplate by mating with Intel processors on the board and Intel® Omni-Path internal faceplate transition (IFT) connectors at the faceplate for 25 Gbps speeds. With standard or customized configurations available, ChipConnect cable assemblies can be utilized with a broad range of other high speed solutions at the faceplate.

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